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1. GENERAL REQUIREMENTS
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I. Vendors must comply with all the requirements specified in this tender document
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Ya
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II. Vendors must bear all costs of supplying the specified quantity of items to UiTM. Such costs shall include the costs of delivery, installation, commissioning, training, troubleshoot and maintenance work (including parts labour and on-site service) within the specified warranty period
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Ya
Tidak
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2. GENERAL SPECIFICATION
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I. Ideally the High-temperature diffusion annealing furnaces for 4-inch silicon wafers or smaller
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Ya
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II. The system should be designed with following mode
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Ya
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III. Solid dopant process
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Ya
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IV. Spin on dopant
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Ya
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V. System should come with Touch Screen with Industrial PC and Programmable Logic Controller that can support diffusion furnace operation.
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Ya
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VI. Data logging and Analysis with computer data acquisition
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Ya
Tidak
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VII. System should be able to deliver the following process
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A ) P type or N type doping process
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B ) Continuous annealing processes.
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Ya
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C ) Doping +/- 5% uniformity across 4-inch wafer or better
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Ya
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3. SYSTEM SPECIFICATION
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I. System meet the following substrate
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A ) A minimum size of 4” inch or better
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Ya
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B ) Aat least 12 wafer/batch for solid dopant or better
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Ya
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C ) At least 25 wafer/batch for spin on dopant or better
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Ya
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D ) Quartz boat to be provided
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Ya
Tidak
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II. The furnace should meet cleanroom requirements with the following properties
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Ya
Tidak
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A ) Enclosed shell housing
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Ya
Tidak
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B ) At least 200 mm isothermal/constant zone present in the system or better
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Ya
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C ) Measurement accuracy less or equal to ±1.0°C
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Ya
Tidak
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D ) The furnace heating rate within 10°C/minute or better
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Ya
Tidak
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E ) A minimum of 3 external Thermocouple(TC) for zone control or better
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Ya
Tidak
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F ) Profile Thermocouple(TC) with 3-point measurement or better
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Ya
Tidak
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G ) Closed pigtail tube design or similar
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Ya
Tidak
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III. Process Tube:
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Ya
Tidak
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A ) The system mainframe should have a double-stack tube capability for the oxidation and diffusion process.
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Ya
Tidak
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B ) The upgradeability of the second tube should be able to be performed on-site
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Ya
Tidak
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IV. Ideally the temperature control profile should meet the following
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Ya
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A ) Temperature accuracy less or equal to ±0.5°C
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Ya
Tidak
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B ) Preferably dual PID(Proportional-Integral-Derivative) temperature control with internal and external TC cascade control
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Ya
Tidak
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C ) Over-temp protection, TC(Thermocouple) disconnection, with manual reset should be provided.
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Ya
Tidak
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D ) Process tempereture at least 200°C to 1300°C or better.
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Ya
Tidak
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V. Sample Loading should meet the following
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Ya
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A ) Automatic boat delivery with sensor protection interlock
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Ya
Tidak
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B ) System should comes with stepper motor for precise loading position.
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Ya
Tidak
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C ) Stops switch and limit protection sensor should be provided.
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Ya
Tidak
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D ) Front loading seal door with lock.
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Ya
Tidak
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VI. Process Gas and Pneumatic:
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Ya
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A ) At least 2 gas channels are required to flow N2, and O2.
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Ya
Tidak
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B ) All gas to be controlled by Mass Flow Controller within 10 to 20 SLM (Standard Liters per Minute) or better.
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Ya
Tidak
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C ) All gas internal piping should be using an Electropolish Grade of SUS316
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Ya
Tidak
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D ) Gas filter for Oxygen and Nitrogen to be provided
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Ya
Tidak
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E ) Solid Dopant with for P-Type and N-Type to be provided
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Ya
Tidak
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VII. Control System:
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Ya
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A ) User administration module must be provided with sub-account permission.
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Ya
Tidak
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B ) System should come with at least 50 programs and 40 steps or better.
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Ya
Tidak
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C ) Suppliers need to demonstrate the process resolution acceptance upon commissioning.
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Ya
Tidak
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D ) All wafers and consumables are to be provided by the supplier during the demonstration
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Ya
Tidak
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E ) A Human Machine Interface (HMI) should control the following parameters:
1)Temperature, time, ramp gradient, etc
2)Recipe editor and data logging capability
3)Process cycle diagram and graph
4)Remote online capability for operation, support and troubleshooting
5)Data recoding with USB flash drive capability
6)Signage and alarm should be provided
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Ya
Tidak
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VIII. Safety and Interlock
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Ya
Tidak
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A ) Over-temp protection of the process tube must be provided
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Ya
Tidak
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B ) Short Circuit Protection must be provided as standard.
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Ya
Tidak
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C ) Manual Emergency Stop must be provided as standard
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Ya
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D ) Recipe lock provided
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Ya
Tidak
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IX. Facilities Requirement
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Ya
Tidak
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A ) Supplier needs to provide a suitable water recirculating chiller with at least 0.4 Mpa and 15 L/min flow rate for the system or better
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Ya
Tidak
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B ) All hook-up and facilities requirements need to be provided by the supplier.
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Ya
Tidak
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C ) Exhaust requirements such as heat exhaust, and process exhaust must be provided and hooked up by the supplier.
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Ya
Tidak
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D ) All gas piping requirements and connections from existing facilities to the system are to be provided by the supplier. A standard gas stick with inline pressure gauge with bright annealing SUS 316 gas pipe are to be used.
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Ya
Tidak
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E ) The complete system should be operable using the Malaysia power rating of 240 V/415V at 50Hz with Malaysia standard 3-pin/isolator without the use of any auxiliary equipment such as a step-down transformer, etc
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Ya
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X. The furnace should come with at least 3 years annual preventive maintenance or better.
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Ya
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XI. Ideally the preventive maintenance should include
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Ya
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A ) Data calibration for spike thermocouple per year
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Ya
Tidak
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B ) Quartz tube cleaning per year
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Ya
Tidak
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C ) 3 zone heating and calibration per year
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Ya
Tidak
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D ) Wafer boat acid cleaning per year
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Ya
Tidak
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4. CATALOGUES/BROCHURES
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Ya
Tidak
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I. Vendors must provide the catalogues / brochures / technical specification manuals with the tender proposal
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Ya
Tidak
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II. Original copies of user and operational manual of the equipment must be provided
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Ya
Tidak
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5. TRAINING
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Ya
Tidak
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I. Vendors are required to provide training for the use, maintenance and troubleshoot of the equipment to the Technical Staff & Lecture of Electrical Engineering School, College of Engineering, UiTM Shah Alam and all training-related costs are borne by the Vendors.
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Ya
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II. A minimum of three (2) days training for a minimum of five (5) participants covering each module. (Vendors must provide details/syllabus of the training module)
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Ya
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III. Complete training materials and documentation must be provided to all participants
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Ya
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IV. The training MUST be conducted by trainers who are certified by principal. Please attach the trainer's certification that is certified by principal Vendors.
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Ya
Tidak
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V. Training certificates must be provided by the Vendors.
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Ya
Tidak
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6. WARRANTY AND SUPPORT
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Ya
Tidak
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I. Vendors must have local service for repair services and provide on call services when required by UiTM
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Ya
Tidak
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II. Vendors must provide details of warranty. INCLUDING ALL parts, labour, basic phone support for hardware issue, repairs onsite). Please attach the Letter of Warranty (LOW) from the principle, which states that UiTM is entitled at least 3 years of warranty upon project completion.
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Ya
Tidak
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III. Vendors be responsible for the installation, commissioning and test-run of the equipment and accompanying software (if applicable) to the satisfaction of UNIVERSITI TEKNOLOGI MARA before final acceptance.
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Ya
Tidak
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IV. All cost on delivery. installation, commissioning, test run and training shall be borne by the vendors.
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Ya
Tidak
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V. The vendors MUST provide a genuine product. The vendors must be supported back-to-back by a principle (manufacturer) to provide maintenance services for equipment supplied. The vendors should attach a Letter of Authorization (LOA) from Distributors/ Principal.
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Ya
Tidak
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VI. Free support through fax, email, telephone must be provided during the warranty period
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Ya
Tidak
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7. OTHER REQUIREMENTS
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Ya
Tidak
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I. Note that all other related material, components and cabling, which are required to ensure full operation of the above package must be supplied and borne by vendors.
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Ya
Tidak
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