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1. GENERAL REQUIREMENTS
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I. Vendors must comply with all the requirements specified in this tender document.
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II. Vendors must bear all costs of supplying the specified quantity of items to UiTM. Such costs shall include the costs of delivery, installation, commissioning, training, troubleshoot and maintenance work (including parts labour and on-site service) within the specified warranty period
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2. GENERAL SPECIFICATION
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I. Reactive ion etching (RIE) will be use for anisotropic etching of all type of silicon based thin films, compound semiconductors: Si, SiO2, SiN, polysilicon, silicon oxy-nitride and amorphous silicon. In addition, it can also be used for fabrication and failure analysis.
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II. The current system should deliver capacitive couple plasma and be able to upgrade for inductive couple plasma RIE system, helium backside cooling and load-lock chamber on site.
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3. SYSTEM SPECIFICATION
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I. Process Chamber
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A ) The machine’s vacuum chamber should be constructed from non-corrosive material, rigid, can stand high temperature and suitably sealed
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B ) The chamber should be able to accommodate up to 4-inch wafer and a variety of smaller wafer sizes and shapes.
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C ) The chamber should have a view port made of quartz or similar.
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D ) The material should be compatible with clean room environment.
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E ) The process chamber should come with rectangular blank port providing upgradeability to add lock load chamber.
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F ) The chamber should come with at least 2 spare ports of KF 25 type or better
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II. Vacuum Pumping System
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A ) Vacuum pumping system should be specified in the tender submission. The brand and model of the pumps with technical specifications/ performances must be submitted for evaluation.
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B ) Vacuum measurement system to measure from atmospheric pressure to high vacuum (10-3 Torr) for base pressure monitoring. Digital display in Torr should be integrated into the control system.
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C ) Pressure measurement & auto process control system.
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D ) Baratron gauge of 10 Torr for auto process pressure control or better
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E ) Automatic closed-loop pressure control system with Precise Digital PID pressure control system
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F ) Appropriate vacuum measurement gauge system
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G ) Rough vacuum should be provided.
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H ) Throttle valve must be provided
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I ) Cold cathode gauge can be added anytime to the system.
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J ) System should come with Turbo Molecular Pump port and upgradeable to foreline vacuum line providing base vacuum up to 10-7Torr.
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III. Radio Frequency(RF) Electrodes and substrate unit
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A ) Configurable for different substrate sizes up to 100mm and other smaller sizes
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B ) RF power: 13.56MHz, at least 600W with fully automatic impedance matching network or better
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C ) Substrate module can be upgrade on site to Helium backside cooling capability.
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IV. Process Gas System and shower head
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A ) At least five MFC for CF4, O2, SF6 , Ar and N2 to be provided.
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B ) The gas port is upgradable and ready to accept additional 2 gas lines or better
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C ) Shower head unit for uniform gas distribution an easy cleaning.
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D ) N2 purge and cleaning capability to process gas Mass Flow Controller.
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E ) The top lid can be upgradeable to an ICP(Inductively Coupled Plasma) antenna with another RF(Radio Frequency) power supply and matching network.
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V. Process Gas and Gas Delivery System
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A ) The vendor is responsible for providing gas piping, etchant gas and gas cylinder for the system proposed.
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B ) Gas purity must exceed 99.99% or better for all the process gas.
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C ) A proper set of gas piping using SUS316 BA(Bright Annealed) needs to be provided by the vendor
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D ) Gas stick for each gas and gas manifold panel for CF4 and SF6 with 0.003 micron filter or better.
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E ) A proper gas manifold standing unit to be constructed in the gas facility room.
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F ) All the stainless-steel regulators, diaphragm valve, high pressure valve to be used and will need to clearly state.
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G ) Supplier require to reallocate all the existing gas panel to the gas room.
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VI. Process Performance
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A ) Detailed specifications about system acceptance (etch rate) should be proposed and provided in the tender submission.
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B ) Anisotropic etching of all types of silicon based thin films, compound semiconductors, Si, SiO2, SiN, polysilicon, silicon oxy-nitride and amorphous silicon.
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C ) Etch uniformity: ±5% within 4 inch sample or better
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D ) Etching rate: at least 300Å/min or better.
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E ) Base pressure: 5 x10-2 Torr within half an hour or better
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VII. Control System and Safety Interlock
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A ) The system meets safety and EMC(Electromagnetic compatibility) requirements.
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B ) A computerized touch panel on PLC for user-friendly interface for parameter control and recipe entry and storage.
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C ) Run at fully automatic "one button” mode and manual mode.
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D ) Recipes to be supplied for Si, SiO2, SiN, polysilicon, silicon oxy-nitride and amorphous silicon and also for cleaning.
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E ) Sequential steps and recipe need to be provided.
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F ) Capable of doing a continuous recipe without breaking vacuum.
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G ) The following safety interlocks must be provided:
1)Cooling water flow
2)Compressed air supply pressure
3)Processing pressure
4)Abnormal pump operation
5)Power failure protection
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VIII. Supplier require to provide at least 3 years annual preventive maintenance or better.
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IX. The preventive maintenance should include.
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A ) Chamber cleaning inclusive of sand blasting and O-Ring replacement per year
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B ) Rotary vane pump oil replacement per year
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C ) RIE air shower cleaning per year
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D ) Gas line quality check per year
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E ) Pressure Check per year
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F ) Leak Check per year
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X. The complete system should be operable using the Malaysia power rating of 240V/415V at 50Hz with Malaysia standard 3-pin/isolator without the use of any auxiliary equipment such as a step-down transformer, etc.
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4. CATALOGUES/BROCHURES
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I. Vendors must provide the catalogues / brochures / technical specification manuals with the tender proposal.
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II. Original copies of user and operational manual of the equipment must be provided.
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5. TRAINING
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I. Vendors are required to provide training for the use, maintenance and troubleshoot of the equipment to the Technical Staff & Lecture of Electrical Engineering School, College of Engineering, UiTM Shah Alam and all training-related costs are borne by the Vendors.
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II. A minimum of three (2) days training for a minimum of five (5) participants covering each module. (Vendors must provide details/syllabus of the training module).
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III. Complete training materials and documentation must be provided to all participants.
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IV. The training MUST be conducted by trainers who are certified by principal. Please attach the trainer's certification that is certified by principal Vendors.
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V. Training certificates must be provided by the Vendors.
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6. WARRANTY AND SUPPORT
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I. Vendors must have local service for repair services and provide on call services when required by UiTM.
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II. Vendors must provide details of warranty. INCLUDING ALL parts, labour, basic phone support for hardware issue, repairs onsite). Please attach the Letter of Warranty (LOW) from the principle, which states that UiTM is entitled to at least 3 years of warranty upon project completion or better
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III. Vendors be responsible for the installation, commissioning and test-run of the equipment and accompanying software (if applicable) to the satisfaction of UNIVERSITI TEKNOLOGI MARA before final acceptance.
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IV. All cost on delivery. installation, commissioning, test run and training shall be borne by the vendors.
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V. The vendors MUST provide a genuine product. The vendors must be supported back-to-back by a principle (manufacturer) to provide maintenance services for equipment supplied. The vendors should attach a Letter of Authorization (LOA) from Distributors/ Principal.
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VI. Free support through fax, email, telephone must be provided during the warranty period
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7. OTHER REQUIREMENTS
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I. Note that all other related material, components and cabling, which are required to ensure full operation of the above package must be supplied and borne by vendors.
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